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Partnerships

Intel

Intel Software Partner Program

Intel

Intel Cluster Ready Program

HP

HP Developer & Solution Partner Program (DSPP).

IBM

Member of IBM PartnerWorld programme.

Microsoft

Microsoft Partner Programme (Certified Member).

SUN

Member of the SDC (SUN Developer Connection).

SGI

Member of the SGI Global Developer Program (Developer Plus level).

Siemens PLM Software Parasolid

FEKO's geometry modeller is based on Parasolid, the world’s leading production-proven 3D geometric modeling component software, providing core functionality that enables users of Parasolid-based products to rapidly and robustly model the industry’s most complex products.

Techsoft3D HOOPS

FEKO incorporates HOOPS, which is a 2D/3D development platform for creating or enhancing professional-grade applications.